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Chemical Vapor Deposition (CVD)

Chemical Vapor Deposition (CVD)

Low-temperature chemical vapor deposition (CVD) is a process whereby a chemical precursor is vaporized and deposited onto the substrate to impart extremely dense, non-line-of-sight coatings. Typical CVD processes are high temperature (>1000°C) which limits compatibility of certain materials. IBC’s proprietary low-temperature CVD process remains under 450°C, allowing substrate materials to maintain their mechanical properties that would otherwise be lost in higher temperature processes. Coating thickness can be controlled with extreme precision from 0.5 to 50 microns depending on the substrate.

Benefits of Chemical Vapor Deposition

  • Completely non-line-of-sight deposition for uniform coating of interior features and complex shapes
  • Excellent surface finish will mirror that of the substrate
  • Low temperature which avoids loss of mechanical properties and risk of dimensional distortion

IBC’s Equipment

  • Small CVD chamber capacity: 14” long x 10” diameter, 20lbs
  • Large scale CVD chamber under construction: ~40” diameter x ~60” tall
ProcessProcess Temperature (°C)Thickness (microns)Hardness (HV)CoF (Dry on Steel)Applications
CeraTough®-0801a-CrC<4500.5-501500-20000.5Corrosion resistance, abrasion and erosion resistance, complex geometries, internal geometries for plastic injection molding